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Method for manufacture of multi-layer wire structure for high efficiency wireless communication
专利权人:
发明人:
Vinit Singh,Christine A. Frysz,Matthew Geary,Eitan Babcock,Justin Derbas
申请号:
US14059044
公开号:
US09306358B2
申请日:
2013.10.21
申请国别(地区):
US
年份:
2016
代理人:
摘要:
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
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