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Head rotating type electroporation apparatus
专利权人:
DERMATECH CO., LTD.;(주)더마테크
发明人:
SHIN, JAE WOO,신재우,SHIN, JAE WOOKR
申请号:
KR1020180029012
公开号:
KR1020190107819A
申请日:
2018.03.13
申请国别(地区):
KR
年份:
2019
代理人:
摘要:
The present invention relates to a head rotational electroporation device which can be manufactured by a small number of parts in a small size since a positive electrode is connected to a rotational shaft connected to a positive (+) power source and a plurality of negative electrodes are connected to a substrate connected to a negative (-) power source, and can stably provide electric currents for electrodes even though a head is rotated by a rotational driving of a driving motor. According to one embodiment of the present invention, the head rotational electroporation device comprises: a head base which has a motor accommodating unit at a center thereof upwardly protruding and a support ring unit having a pogo pin accommodating unit upwardly protruding from an outer side thereof; a driving motor which is accommodated in the motor accommodating unit; a rotational shaft which is rotated and driven by the driving motor and has a positive (+) power source connected thereto; a pogo pin which is accommodated in the pogo pin accommodating unit and has a negative (-) power source connected thereto; a substrate which is rotated and driven by penetrating and being coupled to the rotational shaft and forms a circular plating line having an upper end portion of the pogo pin elastically contacted thereto; a head casing which is coupled to be able to rotate to the head base, is rotated and driven by the substrate inserted into the inside thereof, forms a first through-hole in a center of the top surface thereof and a second through-hole in an outer side thereof; a positive electrode which is inserted into the first through-hole to be coupled to an upper end of the rotational shaft and is exposed to an upper side of the head casing; and a negative electrode which is inserted into the second through-hole to be connected to the circular plating line of the substrate, and is exposed to an upper side of the head casing.본 발명은 (+)전원에 접속되는 회전축에 양전극에 연결되고 (-)전원에 접속되는 기판에 다수의 음전극이 연결되도록 구
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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