COPPETA JONATHAN R,SHELTON KURT,SHEPPARD NORMAN F JR,SNELL DOUGLAS B
申请号：
IN3490/KOLNP/2015
公开号：
IN2015KN03490A
申请日:
2015.10.16
申请国别(地区):
IN
年份:
2016
代理人:
摘要：
A method of fanning an electrical via connection comprising: providing a first nonconductive substrate having an aperture therethrough, wherein the interior surface of said first substrate defining said aperture comprises a layer of a first electrically conductive material providing a second non-conductive substrate having a projecting member extending from a surface of said second substrate, wherein said member is formed of or coated with a second electrically conductive material and compressing the projecting member of said second substrate into the aperture of said first substrate, to locally deform and shear the first and/or second electrically conductive layers, in an amount effective to form a bond and electrical connection between the fust and second electrically conductive layers.
