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Implant Delivery System
专利权人:
MicroVention; Inc.
发明人:
Heath Bowman,Nga Ting Wong,Diana N. Valencia
申请号:
US16705097
公开号:
US20200178975A1
申请日:
2019.12.05
申请国别(地区):
US
年份:
2020
代理人:
摘要:
An implant delivery system having an implant-pusher junction that has improved flexibility due to a shortened heater and tapered marker band. The heater capsule includes a coil having a complex shape made possible through additive manufacturing. The complex shape generates increased heat over a shorter length when compared to traditional linear coils. The marker band includes a tapered end that allows the implant to pivot relative to the pusher.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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