In one embodiment, a method of fabricating a lead comprises: providing a lead body comprising a plurality of conductive wires providing a flex film connector structure, the flex film connector structure comprising a plurality of conductive pads on a first portion of the flex film connector structure, a plurality of contacts on a second portion of the flex film connectors, and a plurality of traces electrically connecting the plurality of conductive pads with the plurality of contacts placing the first portion of the flex film connector adjacent to a cross-section of one end of the lead body electrically coupling the plurality of conductive pads of the flex film connector structure to the plurality of conductive wires at the one end of the lead body and wrapping the second portion of the flex film connector structure about the lead body to form a plurality of electrical contacts.
