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可成型粘結晶片
专利权人:
ConvaTec Technologies Inc.
发明人:
JOHNSEN, Kenneth
申请号:
HK16113647.2
公开号:
HK1225267A
申请日:
2016.11.30
申请国别(地区):
HK
年份:
2017
代理人:
摘要:
Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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