A pressure-sensing device is disclosed, which includes a pressure sensor pad. The pressure sensor pad includes a first planar substrate, a second planar substrate, first signal lines, second signal lines, a plurality of rows of first sensor components, and a plurality of columns of second sensor components. The first signal lines and the rows of first sensor components are formed on the first planar substrate, and each row of the first sensor components is connected to a corresponding one of the first signal lines. The second planar substrate is disposed opposite to the first planar substrate. The second signal lines and the columns of second sensor components are formed on the second planar substrate, and each column of the second sensor components is connected to a corresponding one of the second signal lines, where the second sensor components face the first sensor components respectively.
