A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may be advanced in a machine direction at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between each of a first and a second member. The first member and the second member may be separated by a repitch angle. The second member may be repositioned such that the first member and the second member are separated by a product angle. The first member may receive a leading portion and second member may receive a trailing portion of the substrate assembly and each member may rotate at the first velocity. The leading portion and the trailing portion are separated by a product arc length, which may be equal to a process product pitch. The substrate assembly may then undergo one or more processes such as bonding, cutting, and/or scoring.
