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Lead and conduit placement device and method
专利权人:
Subhajit Datta
发明人:
Subhajit Datta
申请号:
US15083744
公开号:
US09656062B1
申请日:
2016.03.29
申请国别(地区):
US
年份:
2017
代理人:
摘要:
The present invention includes devices and methods for lead or conduit placement in tissues or organs. The devices include a lead or conduit placement device that is configured to permit the placement foot, such as a suction foot, to swivel to a desired position with respect to the target tissue, while the lead is releasably attached to the placement foot to permit it to be released from the placement foot after fixing the lead or conduit in the tissue.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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