An image pickup apparatus for an endoscope includes: an image pickup device including a row of external electrodes provided on an end portion of a light receiving surface； and a wiring board including end portion electrodes ultrasonically bonded to the external electrodes, in which a plurality of grooves are formed in a back face of the image pickup device, and the plurality of grooves are inclined relative to a vibration direction of ultrasonic vibration during the ultrasonic bonding.
