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Ultrasonic device, ultrasonic probe, electronic device and ultrasonic imaging apparatus
专利权人:
セイコーエプソン株式会社
发明人:
清瀬 摂内
申请号:
JP2013012950
公开号:
JP6175780B2
申请日:
2013.01.28
申请国别(地区):
JP
年份:
2017
代理人:
摘要:
An ultrasonic device includes an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body; a fixing frame having a recess to which the ultrasonic element array substrate is fixed, and a perforated portion formed with a through hole by opening a part of the bottom face of the recess, wherein an element-formed surface of the ultrasonic element array substrate is faced to the perforated portion; an acoustic lens secured to the fixing frame so as to cover the perforated portion; and an acoustic matching layer formed of a resin being arranged between the ultrasonic element array substrate and the acoustic lens, so as to secure them to each other. The acoustic lens and the fixing frame are in contact with each other, and the thickness of the acoustic matching layer is maintained at a fixed value.
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