Jerry Ok;Robert J. Greenberg;Jordan Neysmith;Dao Min Zhou;Neil Talbot
发明人:
Robert J. Greenberg,Neil Talbot,Jerry Ok,Jordan Neysmith,Dao Min Zhou
申请号：
US13009769
公开号：
US08880165B2
申请日:
2011.01.19
申请国别(地区):
US
年份:
2014
代理人:
摘要：
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
