PROBLEM TO BE SOLVED: To provide an ultrasonic device which can suppress moisture permeability to a junction between a substrate and a cable to a low level.SOLUTION: An ultrasonic device includes: an ultrasonic element array substrate 14 on which an ultrasonic element transmitting and receiving an ultrasonic wave and an FPC 13 connected to the ultrasonic element are installed; an acoustic lens 16 which has a protrusion part 22 connecting the ultrasonic element array substrate 14 and the FPC 13; and an acoustic matching part 15 which is installed between the ultrasonic element array substrate 14 and the acoustic lens 16. The protrusion part 22 extends along the outer periphery of the ultrasonic element array substrate 14, and a ratio of the protrusion part 22 per unit length in a direction where the protrusion part 22 extends is smaller in a spot where the FPC 13 is installed than a spot where the FPC 13 is not installed.【課題】基板とケーブルとの接合部への透湿性を低く抑制することができる超音波デバイスを提供する。【解決手段】超音波を受発信する超音波素子と超音波素子に接続するFPC13とが設置された超音波素子アレイ基板14と、超音波素子アレイ基板14及びFPC13と接続する突起部22を有する音響レンズ16と、超音波素子アレイ基板14と音響レンズ16との間に設置する音響整合部15と、を備え、突起部22は超音波素子アレイ基板14の外周に沿って延在し、突起部22が延在する方向の単位長あたりに突起部22がしめる割合はFPC13が設置されていない場所に比べてFPC13が設置されている場所の方が小さい。【選択図】図6