CHUNG, YI CHANG,锺宜璋,鍾宜璋,CHANG, WANG YI,张琬宜,張琬宜,CHIU, YI HONG,邱逸闳,邱逸閎
申请号：
TW103119083
公开号：
TWI538874B
申请日:
2014.05.30
申请国别(地区):
TW
年份:
2016
代理人:
摘要：
A microstructure sucker device includes a substrate, a microstructure and an operation surface. The substrate includes a first surface and a second surface. The microstructure is arranged on the first surface of the substrate to form a sucker layer. The operation is provided on the second surface of the substrate and corresponds to the sucker layer. An operation method includes: aligning the sucker layer with a predetermined surface attaching at least one part of the sucker layer to the predetermined surface pressing the at least one part of the sucker layer to discharge at least one amount of air from the microstructure so as to suck the predetermined surface pulling at least one edge of the sucker layer so as to separate the at least one part of the sucker layer from the predetermined surface.一種微細結構吸盤裝置包含一吸盤基板、一微細結構及一按壓操作面。該吸盤基板包含一第一表面及一第二表面。該微細結構設置於該吸盤基板之第一表面,以形成一吸附層。該按壓操作面設置於該吸盤基板之第二表面,且該吸附層對應該按壓操作面。該微細結構吸盤裝置操作方法:利用該吸附層對應於一待吸附表面;將該吸附層之至少一部分對應貼附於該待吸附表面;利用按壓操作該吸附層之至少一部分,以擠壓排出該微細結構內之至少一部分之氣體,以便該吸附層之至少一部分吸附該待吸附表面;將該吸附層之至少一邊緣進行撥開,以便該吸附層之至少一部分剝離該待吸附表面。1‧‧‧微細結構吸盤裝置10‧‧‧吸盤基板11‧‧‧第一表面12‧‧‧第二表面20‧‧‧微細結構5‧‧‧成形模具51‧‧‧成形微結構A‧‧‧按壓操作面
