A method of forming an electrical stimulation lead includes molding an electrically-nonconductive substrate over and between spaced-apart electrically-conductive contacts to form a multi-contact lead assembly. The contacts are disposed along a first face of the substrate with a first face of each of the contacts exposed along the first face of the substrate and an opposing second face of each of the contacts covered by material forming a second face of the substrate. The multi-contact lead assembly is coupled along a first end portion of a lead body with the first face of the multi-contact lead assembly conforming to a shape of an outer surface of the lead body, and with the multi-contact lead assembly wrapping around the outer surface of the lead body. Conductors extending along a length of the lead body are electrically coupled to each of the contacts of the multi-contact lead assembly.
