您的位置: 首页 > 农业专利 > 详情页

BONDING METHOD WITH CURING BY REFLECTED ACTINIC RAYS
专利权人:
INC.;TELEDYNE DALSA
发明人:
Anton Petrus Maria VAN ARENDONK
申请号:
US15317056
公开号:
US20170119326A1
申请日:
2014.07.25
申请国别(地区):
US
年份:
2017
代理人:
摘要:
A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充