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Transducer support, ultrasound probe, and ultrasound imaging apparatus
专利权人:
SAMSUNG ELECTRONICS CO.; LTD.
发明人:
Chang Yeon Won,Hyun Phill Ko,Sung Ki Kim,Jeong Mln Na,Jae Moon Jo
申请号:
US14511511
公开号:
US09858911B2
申请日:
2014.10.10
申请国别(地区):
US
年份:
2018
代理人:
摘要:
The present disclosure provides a transducer support, ultrasound probe, and ultrasound imaging apparatus. The ultrasound transducer support includes a first layer having first areas in which heat transfer materials are arranged and second areas in which sound absorbent materials are arranged, the first and second areas being arranged alternately; and a second layer having third areas located below the first areas in which sound absorbent materials are arranged and fourth areas located below the second areas in which heat transfer materials are arranged.
来源网站:
中国工程科技知识中心
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http://www.ckcest.cn/home/

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