Rajesh V. Iyer,Lea A. Nygren,Stephanie L. McCracken,Mukul Jain,Steven M Dufon,Christine Gale Kronich
申请号：
US12750687
公开号：
US08706228B2
申请日:
2010.03.30
申请国别(地区):
US
年份:
2014
代理人:
摘要：
An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA includes conductive strips connected to a non-conductive block. The non-conductive block possesses, a top side, a bottom side, a front side and a back side. A seamless non-conductive barrier extends from the bottom side and between the front side and the back side. The barrier prevents a pin from contacting another pin and eliminates welding of the ground pin to the side of the ferrule.
