The present invention provides a dental adhesive kit including a bonding material that has a good state stability, that has a good balance between photocurability for LED light irradiation and stability to ambient light, and that is capable of exhibiting high bond strengths to both enamel and dentin with small variability even when subjected to photocuring with a high-power LED irradiation device. The present invention relates to a dental adhesive kit including a primer and a bonding material. The primer includes an acid group-containing monomer, a hydrophilic monomer, and water, and the bonding material includes a hydrophilic monomer (B-1), an aromatic bifunctional monomer (B-2), an aliphatic bifunctional monomer (B-3), α-diketone (B-4), (bis)acylphosphine oxide (B-5), and a benzotriazole compound (B-6) as defined in the description. The content of (B-4) is 0.6 to 2 parts by weight per part by weight of (B-5), and the content of (B-6) is 0.01 to 3 parts by weight per 100 parts by weight of (B-3).
