The current invention concerns a method for distributing absorbent particles onto an endless substrate which is being conveyed along a machine direction through a particle depositing chamber, by deflecting incoming absorbent particles by an oscillating impact means within said particle depositing chamber before deposition, thereby distributing the particles onto the substrate according to a distribution profile. The invention also concerns an apparatus for distributing absorbent particles onto an endless substrate and an absorbent article manufacturable by said method and/or apparatus.
