An orthopaedic implant for filling voids in bones, and methods of using the same. The orthopaedic implant comprises an open porous metal component, having pores for promoting bone regeneration, and a resorbable bone growth promoting component which is resorbed into new bone. The orthopaedic implant and methods of the present disclosure provide structural support for the bone as well as osteoconductive and/or osteoinductive matrix for promoting bone re-growth within bone void. Advantageously, the orthopaedic implants and methods disclosed herein are useful in filling critically sized bone voids.
