Satinderpall S. Pannu,Kedar G. Shah,Heeral Sheth,Sarah H. Felix,Angela C. Tooker
申请号：
US13794579
公开号：
US20140172051A1
申请日:
2013.03.11
申请国别(地区):
US
年份:
2014
代理人:
摘要：
A microelectrode array having one or more electrical conduits surrounded and insulated from each other by only a single layer of polymer (e.g. polyimide), and a method of fabricating the same. Multiple layers of an uncured polymer precursor (such as polyamic acid) are separately formed with metal layers sandwiched in between. Formation of the uncured polymer precursor layers includes deposition and heating to remove solvent only but not polymerize the precursor. Upon completing construction, the array is subjected to a high-temperature curing process that converts the uncured polymer precursor layers into the polymer. The different layers of the polymer precursor are thus covalently bonded together during the curing process to create a single continuous layer (e.g. monolithic block) of polymer, with no polymer-polymer interfaces.
