Todd H. Schaefer;Gary M. Grose;Andrew J. Ries;David B. Engmark;Thomas I. Ceballos
发明人:
David B. Engmark,Gary M. Grose,Todd H. Schaefer,Thomas I. Ceballos,Andrew J. Ries
申请号：
US12109838
公开号：
US08473056B2
申请日:
2008.04.25
申请国别(地区):
US
年份:
2013
代理人:
摘要：
An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.
