Methods of forming sealed devices containing heat sensitive components

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专利权人:

C. Roger Leigh

发明人:

C. Roger Leigh

申请号：

US12597381

公开号：

US08644935B2

申请日:

2008.04.23

申请国别(地区):

US

年份:

2014

代理人:

摘要：

An implantable device is provided. The device is constructed from an open body containing electronic components, a heat-sensitive component, and a sealing component. The device is formed in a moisture controlled environment, such that the heat-sensitive component is attached to the open enclosure after the enclosure has been heated. The sealing component is subsequently affixed to the open enclosure to form a sealed enclosure.

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