您的位置: 首页 > 农业专利 > 详情页

Overmolded components for implantable medical leads and related methods
专利权人:
Raymond Gessler;Mitchell L. Horn-Wyffels;Andrew De Kock;Arienne P. Simon;Joseph A. Cihlar;Jeannette C. Polkinghorne;Erin K. Webb;Joseph J. Schachtner;Joseph J. Nelsen
发明人:
Jeannette C. Polkinghorne,Joseph A. Cihlar,Mitchell L. Horn-Wyffels,Joseph J. Nelsen,Raymond Gessler,Erin K. Webb,Joseph J. Schachtner,Arienne P. Simon,Andrew De Kock
申请号:
US12607806
公开号:
US08463399B2
申请日:
2009.10.28
申请国别(地区):
US
年份:
2013
代理人:
摘要:
The various embodiments disclosed herein relate to medical electrical leads. More specifically, certain embodiments relate to leads having one or more drug-eluting components that are overmolded or otherwise positioned on the lead. Other embodiments relate to leads having one or more patterned surfaces, including some leads with one or more patterned surfaces over which one or more drug-eluting components are positioned. Further implementations relate to leads having one or more overmolded patterned surfaces, including some embodiments in which the overmolded surfaces contain at least one drug-eluting component.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
相关发明人
相关专利

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充