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Ceramic Encapsulation of an Implantable Device
专利权人:
Itzik Mashiach;Adi Mashiach
发明人:
Adi Mashiach,Itzik Mashiach
申请号:
US14307015
公开号:
US20140371824A1
申请日:
2014.06.17
申请国别(地区):
US
年份:
2014
代理人:
摘要:
An implantable device is provided. The implantable device may include a flexible carrier configured for implantation in a subject, at least one pair of modulation electrodes associated with the carrier, an antenna configured to receive an electrical signal disposed on the flexible carrier, a circuit electrically coupling the antenna to the at least one pair of modulation electrodes; and a ceramic housing. At least one of the antenna and the circuit may be located within the ceramic housing.
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中国工程科技知识中心
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