Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates
James Bernard Dunlop, Jr.;Edward Chia-Ning Tang;John Janik;Rob Brindley;Leland Joseph Spangler
发明人:
John Janik,Rob Brindley,Edward Chia-Ning Tang,James Bernard Dunlop, Jr.,Leland Joseph Spangler
申请号：
US13491777
公开号：
US10046158B2
申请日:
2012.06.08
申请国别(地区):
US
年份:
2018
代理人:
摘要：
An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.
