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MODULAR LEAD
专利权人:
Medtronic; Inc.
发明人:
Dale F. Seeley,Michael T. Hegland
申请号:
US15843906
公开号:
US20180169404A1
申请日:
2017.12.15
申请国别(地区):
US
年份:
2018
代理人:
摘要:
Systems, devices, and techniques are disclosed for forming an elongate lead body module of a modular lead. The method may comprise rotating a mandrel, wherein the mandrel extends through a through-hole of a conductor hub, wherein each conductor of a plurality of conductors extend through a respective channel of a plurality of channels of the conductor hub, wherein each conductor of the plurality of conductors extends from a respective bobbin of plurality of bobbins to the channels, wherein the plurality of bobbins are coupled to a carriage, the carriage defining a central opening through which the mandrel passes. The method may comprise moving the carriage away from the conductor hub along a length of the mandrel while the mandrel rotates causing the conductors to coil around the mandrel.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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