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Resin composition and molded body using the same
专利权人:
ユニチカ株式会社
发明人:
椛島 洋平,正木 辰典,川田 憲一,上川 泰生
申请号:
JP2008222972
公开号:
JP5279415B2
申请日:
2008.09.01
申请国别(地区):
JP
年份:
2013
代理人:
摘要:
<;P>;PROBLEM TO BE SOLVED: To provide an environment consideration type thermoplastic resin composition having high rigidity and small warpage property and excellent in heat-resistance, impact-resistance and moldability. <;P>;SOLUTION: The resin composition contains 30-95 mass% of a thermoplastic resin (A), and 5-70 mass% of a glass fiber (B) in which a long diameter/a short diameter ratio of the fiber cross section is 1.5-10. A part or a whole part of the thermoplastic resin (A) is a polyamide resin 11 (A1a) or/and polyamide 1010 resin (A1b). 10 pts.mass or more of polyamide 11 resin (A1a) or/and polyamide 1010 resin (A1b) is contained relative to total 100 pts.mass of the thermoplastic resin (A) and the glass fiber (B). <;P>;COPYRIGHT: (C)2009,JPO&INPIT
来源网站:
中国工程科技知识中心
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