An imaging device includes at least one lens collecting light incident from an object； an imaging sensor receiving light from the at least one lens and converting the received light to an electric signal； a multi-layer substrate electrically connected to the imaging sensor, the multi-layer substrate including electronic components and conductive layers and vias； and a collective cable including at least one coaxial cable. A core connection electrode to which a core of the coaxial cable is connected is formed on a first surface of the multi-layer substrate, the first substrate intersecting with a height direction of the multi-layer substrate, and a shielded-wire connection electrode to which a shielded wire of the coaxial cable is connected is formed on a second surface of the multi-layer substrate that is adjacent to the first surface and that faces to a proximal end from which the collective cable extends.
