Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar； forming an apertured electrically-conductive layer over the mold pillar； and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar； depositing a first metal layer over the mold pillar to provide a first microneedle； removing the first microneedle from the mold pillar； and depositing a second metal layer over the mold pillar to provide a second microneedle.
