您的位置: 首页 > 农业专利 > 详情页

Skin wound healing compositions and methods of use thereof
专利权人:
Wei Li;Mei Chen;David T. Woodley
发明人:
Wei Li,Mei Chen,David T. Woodley
申请号:
US13210200
公开号:
US08410055B2
申请日:
2011.08.15
申请国别(地区):
US
年份:
2013
代理人:
摘要:
A wound healing composition comprising an amount of heat shock protein effective to promote wound healing and a method thereof to apply the composition. A preferred heat shock protein is either full-length hsp90α or the middle domain plus the charged sequence of hsp90α. The composition is topically applied to skin wounds, covering the outer surface of the wound. The heat shock protein acts by promoting migration of both human epidermal keratinocyte and dermal fibroblasts to the wound in order to close, heal, and remodel the wound.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充