An endoscope apparatus includes: a solid-state imaging element including a light receiving surface on a front face thereof； a circuit board arranged on a rear face side of the solid-state imaging element, the circuit board including a wiring pattern a part of which is exposed on a distal end side of the circuit board, the distal end side facing the solid-state imaging element； a first heat dissipation member arranged between the solid-state imaging element and the exposed part of the wiring pattern, the first heat dissipation member being in contact with the rear face of the solid-state imaging element and the exposed part of the wiring pattern； and a cable electrically connected to the wiring pattern. A width of the exposed part of the wiring pattern in contact with the first heat dissipation member is wider than that of the wiring pattern at a central part of the circuit board.
