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GROUND ELECTRICAL PATH FROM AN MLCC FILTER CAPACITOR ON AN AIMD CIRCUIT BOARD TO THE FERRULE OF A HERMETIC FEEDTHROUGH
专利权人:
Greatbatch Ltd.
发明人:
Robert A. Stevenson,Christine A. Frysz,Richard L. Brendel
申请号:
US16045035
公开号:
US20180326206A1
申请日:
2018.07.25
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.
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