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DEEP ULTRAVIOLET LIGHT SOURCE AND PACKAGING METHOD THEREFOR
专利权人:
发明人:
Shengmao BAI,Jie WANG
申请号:
US15559359
公开号:
US20180248086A1
申请日:
2016.03.17
申请国别(地区):
US
年份:
2018
代理人:
摘要:
The invention discloses a deep ultraviolet light source and a packaging method thereof. The deep ultraviolet light source includes a deep ultraviolet light emitting diode chip and a lead frame, the deep ultraviolet light emitting diode chip is fixed on the lead frame, the outside of the deep ultraviolet light source is provided with a transparent protective special layer, the transparent protective special layer forms a convex structure on an top side surface of the deep ultraviolet light emitting diode chip, and the transparent protective special layer forms a recessed structure on the side surface of the deep ultraviolet light emitting diode chip. The convex transparent protective special layer formed on the top side surface of the deep ultraviolet light emitting diode chip and the recessed transparent protective special layer formed on the side can effectively reduce the deep UV loss caused by the total reflection on the side surface and the front top side surface, thereby improving the deep UV radiation level and the UV light source light transmission efficiency in addition, transparent protective special layer is used to replace the quartz lens and protect the deep ultraviolet light diode and that effectively reduces the cost of packaging.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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