PROBLEM TO BE SOLVED: To provide a laser dicing protective film agent which can be formed into a protective film that is high in adhesion to the surface of a wafer, and can effectively prevent debris from attaching to the whole surfaces of chips including their peripheral parts when the chips are manufactured from the wafer by laser dicing.SOLUTION: A solution is used as the protective film agent wherein water-soluble resin and, at least, a laser-beam absorbing agent selected from a group composed of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorbing agent are dissolved. The protective film agent is applied on the processing surface of the wafer 2 and turned into a protective film 24 by drying, and the surface of the wafer is subjected to laser processing in a manner wherein the wafer is irradiated with a laser beam through the protective film 24.COPYRIGHT: (C)2006,JPO&NCIPI【課題】レーザーダイシングによってウエーハよりチップを製造するに際し、ウエーハ表面との接着性が高く、且つチップの周縁部分も含め、その全面にわたってデブリの付着を有効に防止することが可能な保護膜を形成し得るレーザーダイシング用保護膜剤を提供する。【解決手段】水溶性樹脂と、水溶性染料、水溶性色素及び水溶性紫外線吸収剤からなる群より選択された少なくとも1種のレーザー光吸収剤とが溶解した溶液を保護膜剤として使用し、この保護膜剤をウエーハ2加工面に塗布、乾燥して保護膜24を形成し、この保護膜24を通してのレーザー光の照射により、レーザー加工を行う。【選択図】図4
