A wiring board 10 in which a plurality of first electrodes 11 are arranged in a row on a main surface 10 SA a side surface 20 SS is disposed perpendicularly to the main surface 10 SA of the wiring board 10, and a lower surface 20 SB is arranged in parallel , A molded circuit component (MID) 20 made of a nonconductive resin 29 as a base material, in which a plurality of second electrodes 21 are arranged on the lower surface 20SB, and a plurality of first electrodes 11 And a conductive member 40 made of a plurality of conductive pastes each of which is electrically connected to the plurality of second electrodes 21, wherein the plurality of conductive properties The member 40 is accommodated in the reservoir portion formed by the second member and is not in contact with the nonconductive resin 29.主面10SAに複数の第1の電極11が列設されている配線板10と、前記配線板10の前記主面10SAに対して、側面20SSが垂直に、下面20SBが平行に配置されており、前記下面20SBに複数の第2の電極21が列設されている、非導電性樹脂29を母材とする成形回路部品(MID)20と、前記複数の第1の電極11のそれぞれと前記複数の第2の電極21のそれぞれとを、それぞれが電気的に接続している複数の導電性ペースト製の導電性部材40、とを具備する接続構造体1であって、前記複数の導電性部材40が前記第2の部材により形成された溜まり部に収容され、前記非導電性樹脂29と接触していない。
