Jody L. Seifert,Jamie Carroll,David C. Paul,Michael L. Boyer, II,Jason Zappacosta
申请号：
US15958395
公开号：
US20180368891A1
申请日:
2018.04.20
申请国别(地区):
US
年份:
2018
代理人:
摘要：
Interspinous process implants are disclosed. Also disclosed are systems and kits including such implants, methods of inserting such implants, and methods of alleviating pain or discomfort associated with the spinal column.
