An ultrasonic measurement device includes a substrate, an ultrasonic element array, an ultrasonic transducer device, and an integrated circuit device. The ultrasonic element array has a plurality of ultrasonic elements arranged on the substrate. The ultrasonic transducer device is formed on the substrate and having a plurality of signal electrode lines electrically connected to the ultrasonic element array. The integrated circuit device has a plurality of terminals to output a transmission signal to the ultrasonic element array. Each of the signal electrode lines includes an electrode layer in which at least one signal electrode among some of the ultrasonic elements is formed to extend on the substrate. The integrated circuit device is mounted on the substrate, and each of the terminals of the integrated circuit device is connected to a corresponding one of the signal electrode lines.
