An ion-cut machine and method for slicing silicon ingots into thin wafers for solar cell manufacturing is set forth, amongst other embodiments and applications. One embodiment comprises two carousels: first carousel (100) adapted for circulating workpieces (55) under ion beam (10) inside target vacuum chamber (30) while second carousel (80) is adapted for carrying implanted workpieces through a sequence of process stations that may include annealing (60), cleaving (70), slice output (42), ingot replacement (52), handle bonding, cleaning, etching and others. Workpieces are essentially swapped between carousels. In one embodiment, the swapping system comprises a high throughput load lock (200) disposed in the wall of the vacuum chamber (30), a vacuum swapper (110) swapping workpieces between first carousel (100) and load lock (200), and an atmospheric swapper (90) swapping workpieces between load lock (200) and second carousel (80).
