Gregory J. Sherwood,Jay E. Daley,Mary M. Byron,Eric Stemen,Peter Jay Kuhn
申请号：
US13753023
公开号：
US08988859B2
申请日:
2013.01.29
申请国别(地区):
US
年份:
2015
代理人:
摘要：
This document discusses capacitive elements including a first, second and third electrode arranged in a stack. The third electrode is positioned between the first and second electrode. An interconnect includes a unitary substrate shared with the first and second electrodes. The interconnect is adapted to deform to accommodate the stacked nature of the first and second electrodes. The unitary substrate includes a sintered material disposed thereon.
