An image pickup apparatus 10 includes: an image pickup chip 30 including a light receiving section 31 and electrode pads 32 formed around the light receiving section 31, on a first main face 30SA, and a plurality of connection electrodes 34, each of which is connected to each of the electrode pads 32 via each of a plurality of through-hole interconnections 33, on a second main face 30SB； a transparent cover glass 20 having a larger plan-view dimension than the image pickup chip 30； a transparent adhesive layer 41 that bonds the first main face 30SA of the image pickup chip 30 and the cover glass 20； and a sealing member 42 that covers a side face of the image pickup chip 30 and a side face of the adhesive layer 41, and is made of an insulating material having a same plan-view dimension as the cover glass 20.
