Ultrasound systems, devices, and methods for removing heat from within an ultrasound transducer probe are provided herein. An ultrasound transducer probe may include an imaging surface having one or more transducer elements, electronic circuitry, a heat exchanger and a housing. The housing at least partially surrounds the imaging surface, electronic circuitry and heat exchanger or the heat exchanger may simply be operatively coupled to the probe. The electronic circuitry may include processing circuitry that controls transmission of an ultrasound signal from the one or more transducer elements, and driving circuitry operatively coupled to the one or more transducer elements and the processing circuitry. The driving circuitry is configured to drive the transmission of the ultrasound signal by the one or more transducer elements in response to a control signal received from the processing circuitry. The heat exchanger includes a conduit for containing a flow of cooling fluid.
