An interveiiebral implant is provided comprising: a body with an upper wall (1, 1', 1") configured to engage a first vertebral end plate and a lower wall (2, 2', 2") configured to engage a second vertebral end plate, and a load transmitting part configured to transmit load between the upper wall and the lower wall； wherein the load transmitting part is configured to assume a compressed condition in which a distance between the upper wall and the lower wall defines a first height (H1) of the implant and an expanded condition in which the distance between the upper wall and the lower wall defines a second height (H2) of the implant that is greater than the first height； wherein the load transmitting part is attached to the upper wall on at least two connecting locations (a) and is attached to the lower wall on at least two connecting locations (b) and has substantially an X-shape in front view of the implant； and wherein the implant is made of a material that exhibits shape memory properties that permit the implant to remain in the compressed condition without outside forces acting upon it and to change to the expanded condition in response to directing the temperature to a recovery level.
