Joseph C. Stark, III;Mark McChrystal;Andre Siebenhaar;Samuel Schimpf
发明人:
Samuel Schimpf,Mark McChrystal,Joseph C. Stark, III,Andre Siebenhaar
申请号：
US14015542
公开号：
US20140067056A1
申请日:
2013.08.30
申请国别(地区):
US
年份:
2014
代理人:
摘要：
A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
