Jaap Roger Haartsen,Ronald Dekker,Pascal De Graaf,Nicolaas Johannes Anthonius Van Veen,Alphonsus Tarcisius Jozef Maria Schipper
申请号：
US13379226
公开号：
US09072464B2
申请日:
2010.07.16
申请国别(地区):
US
年份:
2015
代理人:
摘要：
A thermal flow sensor integrated circuit for sensing flow in a channel based on temperature measurements, the integrated circuit having a temperature sensing element (30) on a front side of the integrated circuit arranged to face the channel, and a bond pad (60, 200) coupled electrically to the temperature sensing element, for making electrical contact off the integrated circuit, the bond pad being arranged to face away from the channel. By having the bond pad facing away from the channel, the space needed for the bond pad and any connections to it need not extend beyond the temperature sensing element and get in the way of the channel. Hence the temperature sensing element can be located closer to the channel or in the channel to enable measurements with better response time and sensitivity.
