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Thermally activated shape memory spring assemblies for implant expansion
专利权人:
Titan Spine; LLC
发明人:
Chad J. Patterson,Eric M. Gardner
申请号:
US14168152
公开号:
US09615935B2
申请日:
2014.01.30
申请国别(地区):
US
年份:
2017
代理人:
摘要:
Thermal memory springs may form arches, or have coils or spring arms and truss arms that expand from a relaxed state when the thermal memory springs warm to a temperature that is about the body temperature of a human being. The thermal memory springs may be used to expand interbody implants from a compact state into an expanded state once the implant has been inserted into the desired location within the body and the thermal memory springs that form a part of the implant warms to body temperature. Ends of the expanded thermal memory spring may contact a bone surface, thereby being an anti-expulsion edge.
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