The present invention relates to an osseous implant for osteogenesis promotion and maintenance, the implant having an exposed surface, and the improvement comprising an electrical circuit attached to the osseous implant. At least a portion of the electrical circuit comprises a trace of conductive particles deposited on the exposed surface of the osseous implant. The present invention also relates to a method of promoting and maintaining osteogenesis by implanting the osseous implant into a subject. Current is passed through the electrical circuit under conditions effective to promote and maintain osteogenesis in the subject. Also disclosed is a method of making an osseous implant for osteogenesis promotion and maintenance.
