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Packaging for gummy substratum
专利权人:
Steven D. Jensen;Densen Cao
发明人:
Steven D. Jensen,Densen Cao
申请号:
US12885729
公开号:
US09211988B2
申请日:
2010.09.20
申请国别(地区):
US
年份:
2015
代理人:
摘要:
Implementations of the present invention include methods, devices, and systems that provide effective packaging items with at least one gummy surface. In particular, implementations of the present invention provide a package for items with a gummy surface that does not require a separate liner to be placed on the gummy surface. In example implementations, the package includes inadhesive polymers such that the item can be removeably adhered to a portion of the package. Moreover, example embodiments of the present invention provide packaging devices, systems, and methods that allow an item with a gummy surface to be packaged without any part of the package interfacing with the gummy surface.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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