ANDERSON, RICHARD R.,AVRAM, MATHEW,SAKAMOTO, FERNANDA H.,LIMPIANGKANAN, WIKUNDA,FARINELLI, WILLIAM A.
申请号：
SG11201500075W
公开号：
SG11201500075WA
申请日:
2013.07.05
申请国别(地区):
SG
年份:
2015
代理人:
摘要：
Exemplary methods and systems can be provided for resurfacing of skin that include formation of a plurality of small holes, e.g., having widths greater than about 0.2 mm and less than about 0.7 mm or 0.5 mm, using a mechanical apparatus. Compressive and/or tensile forces can then be applied to the treated region of skin as the damage heals to facilitate hole closure, and provide enhanced and/or directional shrinkage of the treated skin area.
